Manufacturer
AMD
ASIX
INTEL
MICROCHIP
NXP
ST MICROELECTRONICS
TEXAS INSTRUMENTS
Additional Feature
10 X 19 FRAME STATUS FIFO
ALSO OPERATES AT 2.5V AND 5V SUPPLY
ALSO OPERATES AT 2.5V OR 5V SUPPLY
ALSO OPERATES AT 2.5V SUPPLY
ALSO OPERATES AT 2.5V/3.3V SUPPLY
ALSO OPERATES AT 3.3V MINIMUM SUPPLY AT 14MHZ
ALSO OPERATES AT 3.3V SUPPLY
ALSO OPERATES AT 3.3V SUPPLY AT 14.9 MHZ
ALSO OPERATES AT 3.3V SUPPLY AT 20 MHZ
ALSO OPERATES AT 5 V SUPPLY
ALSO OPERATES AT 5V SUPPLY
CAN ALSO OPERATES AT 2.5 V SUPPLY
IT ALSO OPERATES AT 48MHZ CLCK @ 2.5V NOM SPLY @ -40 TO 85DEGC, SPI INTRFC IS ALSO AVAILABLE
MODEM CONTROL INPUTS SELECTABLE AS I/O
Address Bus Width
0
10
16
2
20
3
4
5
6
7
8
Boundary Scan
NO
YES
Bus Compatibility
68XX; 80XX
68XXX; 80XXX
8080; Z80; 6800; 68000; 80188; 80186; 80286; MULTIBUS
I2C; RS485; RS232
ISA; MCS-51; 80186
MCS 48; MCS 80; MCS 85; IAPX 86; IAPX 88
MCS 51; MCS 96; IAPX 86; IAPX 88; IAPX 186; IAPX 188
PCMCIA; 68000
S68000
USB
Clock Frequency-Max
16
16.384
20
24
25
3.072
3.125
3.6864
33
4
48
50
6
64
8
80
Communication Protocol
ASYNC, BIT
ASYNC, BIT; I2C
ASYNC, BIT; SYNC, BYTE; BISYNC; EXT SYNC
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC; ADCCP
ASYNC, BIT; SYNC, BYTE; SYNC, SDLC; X.25; BISYNC; EXT SYNC
SYNC, BIT, BYTE, ETHERNET
SYNC, BYTE
Data Encoding/Decoding Method
BIPH-LEVEL(MANCHESTER)
NRZ
NRZ; BIPH-LEVEL(MANCHESTER)
NRZ; NRZI; BIPH-LEVEL(MANCHESTER)
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER)
Data Transfer Rate-Max
.375
.625
0.0046875
0.0078125
0.03125
0.125
0.1875
0.375
0.512
0.625
1.25
1.5
12.5
2
60
External Data Bus Width
0
16
8
IHS ObjectID
106015379
109364380
109364381
113401089
113452499
113452500
114103515
1240595352
1308635567
1380952868
1380952915
1380952923
1380952972
1412336727
1412336771
1413559988
1436273031
1437016853
1437277416
1438425741
1439238961
1480832502
1520786436
1520786437
1539340798
1670848983
1670848984
1670848991
1670848998
1670849006
1670849008
1670849036
1670849044
1670849052
1670849071
1670849072
1670849080
1670849082
1670849108
1670849110
1670849111
1670849112
1670849114
1670849115
1670849116
1670849119
1670849122
1670849148
1670849163
1730707738
1814360069
1814360089
1814360097
1814360127
1814360157
1814360191
1814360195
1814360199
1814360203
1814360207
1814360227
1814360229
1814360233
1814360237
1814360239
1814360249
1814360257
1814360275
1814360285
1814360291
1814360327
1814360353
1814360363
1814360409
1814360411
1814561231
1926826309
1926826310
1944830798
1965983686
1980098577
2064530252
4000174051
4000174052
8065534249
8154157245
8206102275
ASX000000000041
ASX000000000073
ASX000000000112
AX88796-BRKR
JESD-30 Code
R-PDIP-T24
R-PDIP-T28
R-PDIP-T40
R-PDSO-G16
R-PDSO-G24
R-PDSO-G28
R-PDSO-G56
R-PQCC-J44
R-PQFP-G100
R-PQFP-G128
R-XDIP-T28
S-PBGA-B196
S-PQCC-J44
S-PQCC-J52
S-PQCC-J68
S-PQCC-J84
S-PQCC-N24
S-PQCC-N32
S-PQFP-G100
S-PQFP-G128
S-PQFP-G240
S-PQFP-G44
S-PQFP-G48
S-PQFP-G64
S-PQFP-G80
S-XQCC-N64
JESD-609 Code
e0
e3
e4
Length
10
12
14
16.585
16.5862
17.9
19.125
20
24.23
29.31
31.7
37.02
4
5
52.26
7
7.8
9
9.7
Low Power Mode
NO
YES
Moisture Sensitivity Level
1
2
3
NOT APPLICABLE
Number of DMA Channels
0
Number of I/O Lines
0
1
15
4
8
Number of Serial I/Os
1
2
3
4
5
8
Number of Terminals
100
128
16
196
24
240
28
32
4
40
44
48
52
56
64
68
80
84
On Chip Data RAM Width
0
Operating Temperature-Max
125
70
75
85
95
Operating Temperature-Min
0
-25
-40
Package Body Material
CERAMIC
PLASTIC/EPOXY
UNSPECIFIED
Package Code
BGA
DIP
HVQCCN
LFQFP
QCCJ
QFP
SOP
TFQFP
TSSOP
Package Equivalence Code
BGA196,14X14,40
DIP24,.3
DIP28,.6
DIP40,.6
LCC24,.16SQ,20
LCC32,.2SQ,20
LDCC44,.7SQ
LDCC52,.8SQ
LDCC68,1.0SQ
LDCC84,1.2SQ
QFP100,.7X.9
QFP128,.63X.87,20
QFP128,.64SQ,16
QFP44,.5SQ,32
QFP48,.35SQ,20
QFP64,.35SQ,16
QFP64,.47SQ,20
QFP80,.55SQ,20
SOLCC4,.08,20
SOP28,.4
TQFP48,.35SQ
TQFP80,.48SQ,16
TQFP80,.55SQ
TSSOP16,.25
TSSOP24,.25
TSSOP28,.25
TSSOP56,.3,20
Package Shape
RECTANGULAR
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
FLATPACK
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK, THIN PROFILE, FINE PITCH
GRID ARRAY
IN-LINE
SMALL OUTLINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
245
260
NOT SPECIFIED
Power Supplies
1.8,3.3
1.8/5
2.5,3.3
2.5,3.3/5
2.5/3.3
2.5/5
3.3
3.3,3.3/5
3.3/5
5
Qualification Status
Not Qualified
RAM (words)
0
Screening Level
AEC-Q100
Seated Height-Max
1
1.1
1.2
1.6
2.1
2.35
2.65
3.4
4.57
4.7
5.08
Sub Category
Bus Controllers
Other Microprocessor ICs
Serial IO/Communication Controllers
Supply Current-Max
10
100
120
15
2
22
25
250
30
35
40
75
88
Supply Voltage-Max
1.98
3.46
3.6
3.63
5.25
5.5
5.75
Supply Voltage-Min
1.62
2.7
2.97
3
3.14
3.3
4.5
4.75
Supply Voltage-Nom
1.8
3
3.3
5
Surface Mount
NO
YES
Technology
CMOS
MOS
NMOS
Temperature Grade
AUTOMOTIVE
COMMERCIAL
COMMERCIAL EXTENDED
INDUSTRIAL
OTHER
Terminal Finish
MATTE TIN
Matte Tin (Sn)
NICKEL PALLADIUM GOLD
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN
Tin (Sn)
Tin/Lead (Sn/Pb)
Terminal Form
BALL
GULL WING
J BEND
NO LEAD
THROUGH-HOLE
Terminal Pitch
.4
.5
.65
0.4
0.5
0.65
0.8
1
1.27
2.54
Terminal Position
BOTTOM
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
30
40
NOT SPECIFIED
uPs/uCs/Peripheral ICs Type
RISC MICROCONTROLLER
SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS
SERIAL IO/COMMUNICATION CONTROLLER, LAN
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Width
10
12
14
15.24
16.585
16.5862
19.125
24.23
29.31
4
4.4
5
6.1
7
7.5
7.62
9